hongli led,vehicle led chip
With the development of LED light sources from the lighting direction to subdivided fields, LED light sources have raised the demand for high density and miniaturization. The application of automotive light sources has become a popular research field. As an early batch of companies involved in the research and development of automotive light sources, Hongli Zhihui has been actively developing and deploying packaging products in this application field.
Hongli C1616 series of automotive products is a small volume, high lumen density, super condensing type, good heat dissipation product, its driving current is 1.5A, the luminous flux can reach 513lm, and has passed Ts=105℃ aging verification, its Excellent high lumen density, good heat dissipation management and convenient assembly features provide a new and efficient solution for automotive rear lighting, industrial lighting and other fields.
The lumen density of C1616 can reach 200lm/m㎡, which solves the difficulties faced by other similar products such as heat dissipation design, reliability and difficulty of lamp assembly, and has higher product competitiveness in the market.
Increase product life
This high-density C1616 product launched by Hongli Zhihui not only provides high lumen density output, but also does more in-depth research on heat dissipation. As shown in Table 1, the Hongli C1616 is used with a special structure heat dissipation substrate. Compared with the existing structure of the market products, the Tj temperature can be reduced by 15~20 ℃, which can effectively increase the service life of the product.
Reduce customer cooling substrate cost
As shown in Table 2, a comparative analysis of Hongli C1616 with three different structures and thermal conductivity heat dissipation plates:
The lower the thermal conductivity, the higher the junction temperature of the chip and the higher the Tj temperature is by 17°C; using Hongli C1616, the special structure heat dissipation substrate (2.0 W/mK) and the high thermal conductivity substrate (122W/mK), the Tj temperature is basically the same, and use High thermal conductivity substrates are expensive. Therefore, the use of Hongli C1616 can reduce the cost of heat dissipation substrates of customers and achieve the effect of high thermal conductivity substrates.